Summary
SK Hynix and SanDisk have released the first technical specification for High Bandwidth Flash (HBF) through the Open Compute Project, defining capacities up to 512GB and performance grades up to 3.0TB/s. The technology, which focuses on capacity over raw speed and uses the UCIe interconnect, is expected to see AI inference device samples in early 2027, with commercialization likely between late 2027 and 2028.
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