Chip Packaging News

16 Jul 20263:25 pm

technology16 Jul 2026 · 3:25 pm3:25 pm

Cadence Rolls Out AI Agent AuraStack to Speed Circuit Board, Chip Packaging Design

Cadence has introduced AuraStack, an AI agent designed to accelerate the design of circuit boards and chip packaging, allowing engineers to use plain language f

13 Jul 202611:06 am

technology13 Jul 2026 · 11:06 am11:06 am

Create visual

TSMC to Expand Advanced Chip Packaging with Two New Plants in Chiayi

TSMC is set to establish two additional advanced chip packaging plants in Chiayi, Taiwan, further developing the Chiayi Science Park as a major hub for advanced

Chip Packaging News

#Chip Packaging

Cadence Rolls Out AI Agent AuraStack to Speed Circuit Board, Chip Packaging Design

TSMC to Expand Advanced Chip Packaging with Two New Plants in Chiayi

Discover Faster

Stay Organized

Create Effortlessly

Drive Greater Impact

Newsroom FAQs